Device frequency, current, pin count, and reliability requirements continue to increase along with more stringent space and cost requirements. As a result, design engineers face the increasingly difficult task of selecting the optimum connector technology for high performance package-to-board (BGA, LGA, QFN, etc.) applications. Connectors in this application are characterized by high electrical performance, high signal integrity and high density requirements. HCD's proven solderless z-axis SuperButton® and SuperSpring® connector technologies are ideally suited for this market with high speed, low Cres, high current, and reliable connectivity at a competitive cost.
HCD's SuperButton® technology has been designed in with major semiconductor customers worldwide and has been the connector of choice for leading US high end computing, server, and workstation manufacturers.
| Features |
Benefits |
| Signal Integrity |
Enhanced Electrical Performance:
- High Frequency (up to 26 GHZ BW)
- Low Cres (<10mOhm)
- High Current Rating (up to 7A/pin continuous)
- Low Inductance (<0.9 nH)
- Low Crosstalk
|
| High Density, High I/O, Low Profile |
- # I/O in production exceeding 8000
- Standard pitch as low as 0.5mm
- Low profile (as small as 0.8mm)
|
| Solderless Z-Axis Connection |
- Simple to use
- Easy to rework
- Field upgradeable
|
| Reliability |
Unsurpassed Reliability:
- Up to 12 redundant contact points per button
- Mechanical wipe under compression
- Extremely stable over time and temperature
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