Design engineers are increasingly pressured to address difficult packaging challenges by balancing high-speed interconnects, increasing I/O count and space/cost constraints. Incorporating proprietary SuperButton® technology, HCD interposers provide the density and mechanical robustness to address increasing I/O counts and enable parallel board-to-board designs with the high levels of performance and reliability. With stacking heights down to 0.8mm, as well as different PCB orientation (right angle, planar, and stacked,)our board-to-board connectors are the technology of choice at competitive prices.
| Features |
Benefits |
| High Density (with pitches down to 0.5mm) |
Saves space on test boards and works in
large arrays |
| Low Force (starting at 10g/pin) |
Minimize stress on mating boards |
| Low Profile (~0.8mm) and vertical signal path |
Leads to low self inductance and reduced
cross talk |
| Floating |
Leads to self leveling mechanism and accounts
for coplanarity of the raw cards |
| High Frequency (up to 26Ghz) |
To meet increasing bandwidth demands in
mezzanine applications |
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