SuperButton® Technology

• Continuous wire spring structure supported by elastomer
• Scalable interconnect technology that provides engineers a high performance, robust drop-in replacement for pogo pins, fuzz buttons, and other connector technologies
• Excellent choice for high current, high frequency, and high density applications for mezzanine level, board-to-board, board-to-flex, and package-to-board (LGA, BGA, etc.) interconnect requirements
• Preferred solution of interconnect environments constrained by space and force  limitations
• Provides an electrically efficient connection and consistent resistance value from pin to pin
• Redundant contact points
• SuperButton® technology delivers cost reduction with enhanced performance for any standard, non-standard footprint with varied, asymmetric and irregular pitches

As a result of expanding our manufacturing to include the latest equipment upgrades, HCD can now braid finer wires essentially reducing the required force to compress a button.

Introducing HCD's 3rd generation SuperButton® technology

• Low force (starting at 10g/pin)
• Max travel (~16 mils)
• Ideally suited for high density board-to-board, package-to-board, and  board-to-flex applications where clamping force is critical

SuperSpring® Technology

• High strength bi-metal spring structure
• Scalable interconnect technology that provides engineers a reliable and durable drop-in replacement for other connector technologies in low pitch applications that require  large compliance at low force
• SuperSpring® behaves elastically with stable resistance over a large working range
• Excellent choice for very low pitch, high pin count applications for board-to-board, board-to-flex, and package-to-board (LGA, BGA, etc.) interconnect requirements